8-inch Vertical Oxidation Furnace
Function
Technical Parameters
Bhadra™ Vertical High-Temperature Oxidation Furnace HBO200
Advantage
Function: Mainly used in 8-inch high temperature oxidation and annealing process, the equipment can deposite the silicon dioxide film, which plays the role of protection, passivation, buffer media, etc. And can also be used to eliminate lattice defects.
or call:
86-18924169069 / 020-31569374
Technical Parameters
Wafer size: 8 inches
Process type: dry oxygen oxidation, wet oxygen oxidation, dichloroethylene oxygen oxidation and high temperature annealing
Compatible material: Silicon
Application fields: Power semiconductors, Integrated circuits, Substrate materials, Research
